Leverage Module-Based Design to Collaborate Globally on Hardware and Software Data
Software and System-on-a-Chip Designer enables collaboration on software and semiconductor designs to effectively manage changes coming from multiple contributors from within the enterprise. Data can be managed at both the detailed file/directory level, and at a “modular” level of abstraction. Design data contributed by individual teams can be seamlessly integrated into higher level designs.
Description
Software and System-on-a-Chip Designer leverages a unique modular approach to Design Data Management which is optimized for efficient design reuse and multisite collaboration. IP blocks managed as modules are hierarchically combined into designs which are correct-by-construction. Data is managed at the file level within a module, and at the modular level of abstraction as hierarchical connections between modules. As the design changes, new data is automatically replicated at each design site in module and file caches and shared across workspaces. This data sharing infrastructure maximizes performance and guarantees the most efficient use of disk space which can be especially important for large hardware and software designs, Design tool configuration settings and customizations can also be shared across design sites guaranteeing that all design work is performed in a controlled design environment. Hierarchical data structures can be replicated and automatically synchronized as changes occur with Hierarchical Product Structures in 3DEXPERIENCE®, providing a tight integration with enterprise applications such a Hierarchical Defect Tracking and enterprise wide IP management.